The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Feb. 08, 2019
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Masataka Deguchi, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/433 (2006.01); F28F 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4012 (2013.01); F28F 21/02 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4068 (2013.01);
Abstract

A semiconductor device includes a semiconductor element, a cooler, and a heat conductive body. The cooler faces one surface of the semiconductor element, and has a flow passage of a coolant. As viewed from the flow direction of the coolant, a width of the flow passage is wider than a width of the semiconductor element. The heat conductive body is made from graphite having such an anisotropy that a heat conductivity in the in-plane direction of a predetermined surface is higher than a heat conductivity in the normal direction of the predetermined surface. The width of the heat conductive body is wider than the width of the semiconductor element as viewed from the flow direction of the coolant. The heat conductive body is configured such that the predetermined surface is non-parallel to both of the flow direction of the coolant and the one surface of the semiconductor element.


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