The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jun. 12, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Joo Young Choi, Suwon-Si, KR;
Joon Sung Kim, Suwon-Si, KR;
Young Min Kim, Daejeon, KR;
Da Hee Kim, Suwon-Si, KR;
Tae Wook Kim, Suwon-Si, KR;
Byung Ho Kim, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a support member having first and second surfaces, having a cavity, and including a wiring structure, a semiconductor chip having connection pads, a connection member including a first insulating layer, a first redistribution layer on the first insulating layer, and a plurality of first vias connecting the wiring structure and the connection pads to the first redistribution layer and an encapsulant encapsulating the semiconductor chip, The wiring structure includes wiring patterns disposed on the second surface of the support member, and the first insulating layer includes a first insulating coating covering the wiring patterns and a second insulating coating disposed on the first insulating coating and having a higher level of flatness than that of the first insulating coating.