Substrate inverting device, substrate processing apparatus, and substrate supporting device, and substrate inverting method, substrate processing method, and substrate supporting method

Abstract

A pair of guide parts of a substrate inverting device comes in contact with the peripheral edge portion of a substrate on both sides in the width direction of the substrate. The switching mechanism changes a state of contact between the pair of guide parts and the substrate by switching the positions of the pair of guide parts between a first contact position and a second contact position. Each of the pair of guide parts has a first contact region and a second contact region. The second contact region is located at a position different in the up-down direction and the width direction from the position of the first contact region. The substrate inverting device is capable of switching regions of the guide parts that come in contact with the substrate between the first contact regions and the second contact regions in accordance with the state of the substrate.