The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
May. 02, 2016
Applicants:
Chan-long Shieh, Paradise Valley, AZ (US);
Gang Yu, Santa Barbara, CA (US);
Inventors:
Chan-Long Shieh, Paradise Valley, AZ (US);
Gang Yu, Santa Barbara, CA (US);
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 31/18 (2006.01); H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 25/04 (2014.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 25/00 (2006.01); H01L 27/12 (2006.01); H01L 33/44 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/67144 (2013.01); H01L 21/67721 (2013.01); H01L 21/68757 (2013.01); H01L 21/68778 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 27/1222 (2013.01); H01L 27/1225 (2013.01); H01L 31/18 (2013.01); H01L 33/0095 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2224/83 (2013.01); H01L 2224/95 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06555 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); Y10T 29/4913 (2015.01); Y10T 156/171 (2015.01);
Abstract
A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.