The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Feb. 15, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Kohei Miki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/28 (2006.01); H01L 21/84 (2006.01); H01L 21/306 (2006.01); H01L 23/31 (2006.01); H01L 21/3105 (2006.01); H01L 21/308 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30621 (2013.01); H01L 21/0273 (2013.01); H01L 21/3081 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01L 21/31058 (2013.01); H01L 23/3171 (2013.01); H01L 29/66462 (2013.01); H01L 29/2003 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes: forming a multilayered epitaxial structure on a substrate; applying a novolac-based resist on the multilayered epitaxial structure and patterning the resist through transfer; tapering a shape of the patterned resist by baking; dry-etching the multilayered epitaxial structure using the tapered resist as a mask; and after the dry etching, removing the resist and forming a coating film on the multilayered epitaxial structure, wherein an etching selection ratio between the resist and the multilayered epitaxial structure in the dry etching is controlled to 0.8 to 1.2 so that an inclination is formed in the multilayered epitaxial structure.


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