The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 07, 2018
Applicant:

Taiyo Yuden Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Satoshi Kobayashi, Takasaki, JP;

Takahisa Fukuda, Takasaki, JP;

Tomoaki Nakamura, Takasaki, JP;

Mikio Tahara, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 3/3442 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01);
Abstract

In an exemplary embodiment, a multilayer ceramic capacitor has, at two opposing respective end parts of a capacitor bodyof roughly rectangular solid shape, external electrodesthat each have a conductive resin layer Finside. Each of the external electrodescontinuously has an end face partcorresponding to one face, and a wraparound partcorresponding to four faces surrounding the one face, of the capacitor body. Also, the end face partof each of the external electrodeshas a bulging parton the outer face of the end face part. An electronic component using the multilayer ceramic capacitor can maximally prevent the Manhattan phenomenon that may otherwise occur when the electronic component is mounted on a circuit board, even though its external electrodes have the conductive resin layer inside.


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