The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Sep. 11, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, Tokyo, JP;

Inventors:

Maya Inagaki, Yokohama Kanagawa, JP;

Masaru Koyanagi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/22 (2006.01); H02H 9/04 (2006.01); H01L 25/065 (2006.01); H01L 27/02 (2006.01); G11C 16/30 (2006.01); H01L 23/60 (2006.01); H01L 25/18 (2006.01); G11C 16/04 (2006.01); G11C 16/10 (2006.01); G11C 16/26 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G11C 16/22 (2013.01); G11C 16/0483 (2013.01); G11C 16/30 (2013.01); H01L 23/60 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 27/0266 (2013.01); H01L 27/0285 (2013.01); H01L 27/0288 (2013.01); H02H 9/046 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/15311 (2013.01);
Abstract

According to an embodiment, a semiconductor storage device includes a first chip including a power supply protection circuit. The power supply protection circuit including: a resistor including a first end connected to the second pad; a first capacitor including a first end connected to a second end of the resistor; a first transistor including a first end connected to the second pad, a second end connected to a node with a signal of a value based on a voltage of the first end of the first capacitor, and a gate connected to the first pad; a first inverter including an input terminal connected to the second end of the first transistor; and a second transistor including a gate connected to an output terminal of the first inverter.


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