The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jan. 19, 2015
Applicant:

Leica Microsystems Cms Gmbh, Wetzlar, DE;

Inventors:

Falk Schlaudraff, Butzbach, DE;

Andrew Lee, Allen, TX (US);

Florian Hoffmann, Giessen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G02B 21/06 (2006.01); G02B 21/36 (2006.01); G02B 21/32 (2006.01); G01N 1/28 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00127 (2013.01); G01N 1/286 (2013.01); G02B 21/06 (2013.01); G02B 21/32 (2013.01); G02B 21/365 (2013.01); G01N 2001/2886 (2013.01);
Abstract

A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.


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