The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 26, 2017
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Dmitry Obukhov, San Jose, CA (US);

Muthukumar Karuppiah, San Ramon, CA (US);

Khurram Ismail, Milpitas, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/20 (2006.01); H05K 1/18 (2006.01); H02N 99/00 (2006.01); G01P 3/487 (2006.01); G01P 13/04 (2006.01); G01D 21/00 (2006.01); H04B 1/38 (2015.01);
U.S. Cl.
CPC ...
G01D 5/2006 (2013.01); G01D 21/00 (2013.01); G01P 3/487 (2013.01); G01P 13/045 (2013.01); H02N 99/00 (2013.01); H05K 1/181 (2013.01); H04B 1/38 (2013.01); H05K 2201/09009 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A sensing apparatus may include a printed circuit board (PCB) having a processing unit, a positioning sensor, an environmental sensor and one or more inductive elements positioned within a region at an edge of the PCB. The one or more inductive elements may be configured to generate electrical energy for the processing unit by passing through a magnetic field. The apparatus may also include a spindle implemented through the PCB, such that the spindle protrudes through a substantially central location relative to one plane of the PCB.


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