The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

May. 14, 2019
Applicant:

Wuxi Jinshun Lighting Technology Co., Ltd, Wuxi, CN;

Inventor:

Haijun Wang, Wuxi, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/71 (2015.01); H01L 33/64 (2010.01); F21V 29/503 (2015.01); F21V 29/51 (2015.01); F21V 29/76 (2015.01); F21V 5/04 (2006.01); F21V 7/00 (2006.01); F21V 13/04 (2006.01); F21V 29/89 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/717 (2015.01); F21V 5/04 (2013.01); F21V 7/00 (2013.01); F21V 13/04 (2013.01); F21V 29/503 (2015.01); F21V 29/51 (2015.01); F21V 29/76 (2015.01); F21V 29/89 (2015.01); H01L 33/642 (2013.01); H01L 33/648 (2013.01); F21Y 2115/10 (2016.08);
Abstract

The present invention belongs to the technical field of high-power LED lamps, and relates to a high-power LED lamp with a heat dissipation effect, including a shell body. The shell body includes a heat sink main body and a heat sink cover board covering on a back surface of the heat sink main body. A plurality of heat pipes are embedded between the heat sink main body and the heat sink cover board, and an LED chip is placed on a front surface of the heat sink main body. The position of the heat sink main body where the LED chip is placed is the chip heat collecting area, all the heat pipes pass under the chip heat collecting area, and are in close contact with the chip heat collecting area.


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