The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jan. 04, 2019
Applicant:
Adamant Namiki Precision Jewel Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
ADAMANT NAMIKI PRECISION JEWEL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/27 (2006.01); C30B 25/18 (2006.01); C30B 25/02 (2006.01); C30B 29/04 (2006.01); C30B 23/02 (2006.01); C30B 25/20 (2006.01); C30B 29/60 (2006.01); C30B 25/10 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 29/04 (2006.01); H01L 29/16 (2006.01); H01L 29/34 (2006.01);
U.S. Cl.
CPC ...
C30B 25/183 (2013.01); C23C 16/274 (2013.01); C23C 16/279 (2013.01); C30B 23/025 (2013.01); C30B 25/02 (2013.01); C30B 25/105 (2013.01); C30B 25/20 (2013.01); C30B 29/04 (2013.01); C30B 29/605 (2013.01); H01L 21/02527 (2013.01); H01L 21/02609 (2013.01); H01L 21/7806 (2013.01); H01L 29/045 (2013.01); H01L 29/1602 (2013.01); H01L 29/34 (2013.01);
Abstract
The crystal plane in the interior of the diamond substrate has a curvature higher than 0 kmand equal to or lower than 1500 kmby preparing a base substrate, forming a plurality of pillar-shaped diamonds formed of diamond single crystals on one side of the base substrate, causing diamond single crystals to grow from tips of each pillar-shaped diamond, coalescing each of the diamond single crystals grown from the tips of each pillar-shaped diamond to form a diamond substrate layer, separating the diamond substrate layer from the base substrate, and manufacturing the diamond substrate from the diamond substrate layer.