The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Feb. 11, 2016
Applicant:

Walter Ag, Tubingen, DE;

Inventors:

Veit Schier, Echterdingen, DE;

Wolfgang Engelhart, Metzingen, DE;

Assignee:

WALTER AG, Tubingen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C23C 14/06 (2006.01); C23C 14/35 (2006.01); B23C 5/16 (2006.01); C23C 30/00 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3485 (2013.01); B23C 5/16 (2013.01); C23C 14/0641 (2013.01); C23C 14/35 (2013.01); C23C 28/042 (2013.01); C23C 28/044 (2013.01); C23C 30/005 (2013.01); H01J 37/3426 (2013.01); H01J 37/3467 (2013.01); B23C 2222/14 (2013.01); B23C 2222/84 (2013.01); B23C 2228/08 (2013.01); B23C 2228/10 (2013.01);
Abstract

A solid carbide milling cutter has a substrate of hard metal and a multi-layer coating deposited at least to surface regions that contact a workpiece during a milling operation. The multi-layer coating includes a single-layer or a multi-layer functional layer deposited directly on the substrate surface and a single-layer or a multi-layer covering layer deposited on the functional layer. The functional layer has one or more layers of TiAlN with 0.3≤x≤0.55. The covering layer has one or more layers of ZrN. The functional layer and the covering layer are deposited by HIPIMS, wherein during the deposition of the functional layer power pulses are applied to each sputtering target consisting of material to be deposited, which power pulses transfer an amount of energy to each sputtering target that exceeds a maximum power density in the pulse of ≥500 W/cm.


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