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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10619047 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Jun. 07, 2016

Curable composition

Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventors:

Naoko Tsuji, Himeji, JP;

Hiroki Tanaka, Himeji, JP;

Akira Yamakawa, Himeji, JP;

Akihiro Shibamoto, Himeji, JP;

Nobuhiko Harada, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Robert S Loewe

Int. Cl.
CPC ...
C08L 83/06 (2006.01); C09J 183/06 (2006.01); C09J 11/06 (2006.01); C09J 7/20 (2018.01); C08G 59/32 (2006.01); C09J 7/35 (2018.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 37/14 (2006.01); C09J 11/04 (2006.01); C08G 77/14 (2006.01); C08G 77/04 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); B32B 7/12 (2013.01); B32B 27/283 (2013.01); B32B 37/142 (2013.01); C08G 59/32 (2013.01); C09J 7/20 (2018.01); C09J 7/35 (2018.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 183/06 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/03 (2013.01); B32B 2305/72 (2013.01); B32B 2383/00 (2013.01); C08G 77/045 (2013.01); C08G 77/14 (2013.01); C08L 2205/025 (2013.01);
Abstract

Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.

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