The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jul. 27, 2015
Applicant:
Evonik Operations Gmbh, Essen, DE;
Inventors:
Uwe Albinus, Bad Vilbel, DE;
Johannes Daenner, Kaltensundheim, DE;
Manfred Dannehl, Kahl am Main, DE;
Matthias Schindler, Gelsenkirchen, DE;
Gabriele Gaertner, Hanau, DE;
Assignee:
Evonik Operations GmbH, Essen, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 3/12 (2006.01); B28B 1/52 (2006.01); C04B 35/82 (2006.01); C04B 41/49 (2006.01); C04B 30/02 (2006.01); C04B 30/00 (2006.01); C04B 41/64 (2006.01); C04B 41/00 (2006.01); C04B 32/00 (2006.01); B28B 11/04 (2006.01); C04B 35/64 (2006.01); F16L 59/02 (2006.01); C04B 111/27 (2006.01); C04B 111/28 (2006.01);
U.S. Cl.
CPC ...
C04B 35/82 (2013.01); B28B 1/52 (2013.01); B28B 3/123 (2013.01); B28B 11/04 (2013.01); C04B 30/00 (2013.01); C04B 30/02 (2013.01); C04B 32/00 (2013.01); C04B 35/64 (2013.01); C04B 41/009 (2013.01); C04B 41/4944 (2013.01); C04B 41/64 (2013.01); F16L 59/028 (2013.01); C04B 2111/27 (2013.01); C04B 2111/28 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/5216 (2013.01); C04B 2235/614 (2013.01); C04B 2235/77 (2013.01); C04B 2235/9607 (2013.01);
Abstract
Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the hydrophobizing agent with formation of the hydrophobic thermal-insulation moulding, where