The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 26, 2014
Applicant:

The Boeing Company, Huntington Beach, CA (US);

Inventor:

Douglas R. Jungwirth, Porter Ranch, CA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/042 (2014.01); H01L 31/18 (2006.01); B32B 37/10 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1018 (2013.01); B32B 37/06 (2013.01); B32B 2305/72 (2013.01); B32B 2457/12 (2013.01); B32B 2605/00 (2013.01); B32B 2605/18 (2013.01);
Abstract

Methods, apparatuses, and systems are disclosed for manufacturing a structure having layers that may operate in low pressure or vacuum environments. More particularly, methods, apparatuses, and systems are disclosed for minimizing the effects of voids by eliminating their contents in layers of bonded structures. In some implementations, a method for improving bonding within a layered structure comprises applying a bonding material layer to a substrate layer; disposing a wicking material in the bonding material layer, said wicking material having an outer surface; applying a surface material layer to the bonding material layer to form a layered structure; and curing the layered structure.


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