The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Nov. 16, 2017
Applicant:
Omron Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Wakahiro Kawai, Konan, JP;
Assignee:
OMRON Corporation, Kyoto-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H01C 1/034 (2006.01); H01C 1/14 (2006.01); H01C 17/00 (2006.01); H01G 2/10 (2006.01); H01G 13/00 (2013.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); H01C 1/034 (2013.01); H01C 1/14 (2013.01); H01C 17/006 (2013.01); H01G 2/103 (2013.01); H01G 13/003 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3185 (2013.01); H01L 24/05 (2013.01); B29C 2045/1486 (2013.01); B29L 2031/34 (2013.01);
Abstract
An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.