The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Mar. 11, 2016
Diamet Corporation, Niigata-shi, JP;
Takashi Nakai, Niigata, JP;
Kinya Kawase, Niigata, JP;
Diamet Corporation, Niigata-shi, JP;
Abstract
In a die for compressing and sizing a sintered body at straight portions, upper taper portions are provided on a die upper portion and a core rod upper portion, and the straight portions are provided at a die lower portion and a core rod lower portion. The die upper portion and the core rod upper portion have Young's moduli higher than the die lower portion and the core rod lower portion. The die upper portion and the core rod upper portion are made of materials having Young's moduli that are at least 50 GPa higher than that of the sintered body. The sintered body can be densified with a smaller ironing margin. Since the sintered body is ironed without being compressed, by the upper taper portions and the core rod upper portion having high Young's moduli, the die is prevented from breaking and being abraded due to ironing.