The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jun. 21, 2017
Applicant:
Second Sight Medical Products, Inc., San Fernando, CA (US);
Inventors:
Jerry Ok, Canyon Country, CA (US);
Robert J Greenberg, Los Angeles, CA (US);
Neil Hamilton Talbot, La Cresenta, CA (US);
James S Little, Arvada, CO (US);
Rongqing Dai, Valencia, CA (US);
Jordan Matthew Neysmith, Mountain View, CA (US);
Kelly H McClure, Simi Valley, CA (US);
Assignee:
Second Sight Medical Products, Inc., Sylmar, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61F 15/00 (2006.01); A61N 1/375 (2006.01); H01L 23/055 (2006.01); H01L 23/06 (2006.01); H01L 23/08 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36046 (2013.01); A61F 15/001 (2013.01); A61N 1/0543 (2013.01); A61N 1/36125 (2013.01); A61N 1/375 (2013.01); H01L 23/055 (2013.01); H01L 23/06 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); A61N 1/0529 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01);
Abstract
An implantable device having a biocompatible hermetic package made from a biocompatible electrically non-conductive substrate and a cover bonded to the substrate. In integrated circuit and passive circuits all bonded directly to the substrate.