The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Mar. 28, 2016
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:
Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/00 (2006.01); A61B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 1/051 (2013.01); A61B 1/0008 (2013.01); A61B 1/00018 (2013.01); A61B 1/00114 (2013.01); A61B 1/05 (2013.01); A61B 1/00096 (2013.01); A61B 1/0676 (2013.01);
Abstract

An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.


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