The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

May. 29, 2018
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Travis L. Mayberry, McKinney, TX (US);

Michael J. Arthur, Indianapolis, IN (US);

James A. Pruett, Allen, TX (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); H05K 7/20 (2006.01); B33Y 80/00 (2015.01); B22F 3/105 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); B22F 3/105 (2013.01); B22F 5/00 (2013.01); B33Y 80/00 (2014.12); B22F 2999/00 (2013.01);
Abstract

A manifold structure is provided to cool a heat-dissipating surface and includes an inlet fluid passage, an outlet fluid passage, and at least one cooling channel that is connected between the inlet fluid passage and the outlet fluid passage and extends along a length of the heat-dissipating surface. Additively manufactured fins are arranged in the cooling channel. The fins are configured to provide a geometry transition area between fins having a first geometry and fins having a second geometry, and a material transition area between fins formed of a first material and fins formed of a second material. The manifold structure is configured to provide a gradient convection coefficient by way of the geometry transition area and a gradient thermal conductivity by way of the material transition area across the length of the heat-dissipating surface.


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