The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Dec. 12, 2017
Applicant:

Cloud Light Technology Limited, Hong Kong, HK;

Inventors:

Gad Joseph Hubahib Gaviola, Hong Kong, HK;

Vincent Wai Hung, Hong Kong, HK;

Margarito P. Banal, Jr., Hong Kong, HK;

Vivian Wei Ma, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 5/0004 (2013.01); H05K 7/20336 (2013.01); H05K 2201/10522 (2013.01);
Abstract

The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.


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