The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Feb. 05, 2019
Skyworks Solutions, Inc., Woburn, MA (US);
Yi Liu, San Diego, CA (US);
Anthony James Lobianco, Irvine, CA (US);
Matthew Sean Read, Foothill Ranch, CA (US);
Hoang Mong Nguyen, Fountain Valley, CA (US);
Howard E. Chen, Anaheim, CA (US);
Stephane Richard Marie Wloczysiak, Irvine, CA (US);
William J. Domino, Yorba Linda, CA (US);
Bipul Agarwal, Irvine, CA (US);
SKYWORKS SOLUTIONS, INC., Woburn, MA (US);
Abstract
Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.