The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Aug. 18, 2016
Applicant:

Nec Corporation, Tokyo, JP;

Inventor:

Toshihide Kuwabara, Tokyo, JP;

Assignee:

NEC CORPORATION, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/107 (2006.01); H01L 23/66 (2006.01); H01P 1/02 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01L 23/14 (2013.01); H01L 23/66 (2013.01); H01L 24/00 (2013.01); H01P 1/02 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16251 (2013.01);
Abstract

A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube member constituting a package of the chip and the waveguide tube by including the waveguide tube and supporting the module substrate, the module substrate includes: a base member; a line pattern including a microstrip line portion, a fin line portion, and an interface portion formed on one of surfaces of the base member; a ground pattern formed on the other surface of the base member; and a cavity defined by a hole formed through the base member at a center portion thereof and a surface of the ground pattern on a side where the line pattern is formed as a bottom surface for mounting the chip on the bottom surface thereof, and the microstrip line portion and the chip are wire-bonded at the substantially same level.


Find Patent Forward Citations

Kuwabara, Toshihide. (2020). Millimeter wave semiconductor apparatus including a microstrip to fin line interface to a waveguide member (U.S. Patent No. 10615481). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10615481

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…