The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Jan. 08, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jrjyan Jerry Chen, Campbell, CA (US);

Soo Young Choi, Fremont, CA (US);

Xiangxin Rui, Campbell, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/56 (2006.01); C23C 16/34 (2006.01); C23C 16/30 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C23C 16/505 (2006.01); H01L 21/68 (2006.01); H01L 21/677 (2006.01); C23C 16/04 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); C23C 16/042 (2013.01); C23C 16/308 (2013.01); C23C 16/345 (2013.01); C23C 16/402 (2013.01); C23C 16/403 (2013.01); C23C 16/405 (2013.01); C23C 16/407 (2013.01); C23C 16/50 (2013.01); C23C 16/505 (2013.01); C23C 16/56 (2013.01); H01L 21/67742 (2013.01); H01L 21/681 (2013.01); H01L 51/56 (2013.01); H01L 21/67167 (2013.01);
Abstract

Embodiments described herein generally relate to a method and apparatus for encapsulating an OLED structure, more particularly, to a TFE structure for an OLED structure with desired profile control of the TFE structure. In one example, a method for forming a thin film encapsulation structure over an OLED structure includes forming a thin film encapsulation structure over an OLED structure disposed on a substrate, and performing a plasma treatment process to the thin film encapsulation structure by supplying a treatment gas mixture including a halogen containing gas to the thin film encapsulation structure.


Find Patent Forward Citations

Loading…