The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Jan. 09, 2017
Applicant:
Maven Optronics Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
MAVEN OPTRONICS CO., LTD., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/507 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A chip-scale packaging (CSP) LED device, comprising an LED semiconductor die and a packaging structure, is disclosed. The LED semiconductor die is encapsulated by the packaging structure, wherein the lower surface of the packaging structure has a recessed space underneath. A manufacturing method of the CPS LED device is also disclosed.