The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Mar. 26, 2019
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Jinah Kim, Seoul, KR;

Ilhyoung Jung, Seoul, KR;

Seunghwan Shim, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/068 (2012.01); H01L 31/0747 (2012.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1884 (2013.01); H01L 31/022425 (2013.01); H01L 31/022441 (2013.01); H01L 31/022466 (2013.01); H01L 31/0682 (2013.01); H01L 31/0747 (2013.01); H01L 31/18 (2013.01); H01L 31/02168 (2013.01); Y02E 10/547 (2013.01);
Abstract

A method for manufacturing a solar cell includes applying an electrode paste on a semiconductor substrate, the electrode paste including fine metal particles, a binder, and a solvent; and sintering the electrode paste using light to form an electrode, the sintering of the electrode paste to form the electrode including evaporating the solvent included in the electrode paste; and irradiating the light, after the evaporating of the solvent, to evaporate the binder included in the electrode paste and sinter the fine metal particles to form the electrode, the evaporating of the solvent and the irradiating of the light being performed at different temperatures, a temperature to evaporate the binder being higher than a temperature of the evaporating of the solvent, the solvent being evaporated at the temperature of about 80° C. to 150° C., and the binder being evaporated at the temperature of about 100° C. to 500° C.


Find Patent Forward Citations

Loading…