The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Sep. 26, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hassan Naser, Austin, TX (US);

Daniel Stasiak, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 21/76816 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01);
Abstract

Structure and method for a backside capacitor using through-substrate vias (TSVs) and backside metal plates. The structure includes: a substrate, a device layer over the substrate, a first plurality of metal layers connected to the device layer, where the device layer and the first plurality of metal layers are disposed on a first side of the substrate, and a second plurality of metal layers disposed on a second side of the substrate opposite the first side, where the second plurality of metal layers form at least one capacitor and where a plurality of through-substrate vias (TSVs) extend between the first plurality of metal layers and the second plurality of metal layers.


Find Patent Forward Citations

Loading…