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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10615191 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Apr. 21, 2017

Polymer substrate for flexible electronics microfabrication and methods of use

Applicant:

Ares Materials, Inc., Dallas, TX (US);

Inventors:

Radu Reit, Carrollton, TX (US);

Adrian Avendano-Bolivar, Plano, TX (US);

David Arreaga-Salas, Garland, TX (US);

Assignee:

ARES MATERIALS INC., Dallas, TX (US);

Attorney:

McGuireWoods LLP

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
H01L 27/12 (2006.01); B05D 1/00 (2006.01); B05D 1/28 (2006.01); B05D 3/00 (2006.01); H01L 29/786 (2006.01); H05K 1/18 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1266 (2013.01); B05D 1/005 (2013.01); B05D 1/28 (2013.01); B05D 3/007 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 29/7869 (2013.01); H01L 29/78603 (2013.01); H05K 1/189 (2013.01); H01L 27/3262 (2013.01); H01L 51/0097 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0108 (2013.01);
Abstract

Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.

Find Patent Forward Citations

Reit, Radu. (2020). Polymer substrate for flexible electronics microfabrication and methods of use (U.S. Patent No. 10615191). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10615191

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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