The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Aug. 27, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Takami Otsuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/367 (2013.01); H01L 23/488 (2013.01); H01L 24/05 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32227 (2013.01); H01L 2924/10272 (2013.01);
Abstract

A semiconductor device according to the present invention includes a resist provided so as to have an opening on a metal pattern, the resist having a protrusion part protruding into the opening, and the semiconductor device further includes a semiconductor element having an outside dimension smaller than an outside dimension of the opening excluding the protrusion, and solder provided inside the opening to join the metal pattern and the semiconductor element, wherein the protrusion part of the resist includes a plurality of protrusions that overlap with the semiconductor element in a plan view and regulate a thickness direction of the semiconductor element.


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