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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10615131 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Aug. 27, 2018

Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yasunari Hino, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Andrew Q Tran

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01); H01L 23/053 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4875 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/50 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 23/3121 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/351 (2013.01);
Abstract

The semiconductor device includes a metal plate, a semiconductor element held on the metal plate, a wiring board connected to a surface electrode of the semiconductor element in a facing manner and a conductor fixed to the wiring board wired to the semiconductor element. The conductor has a plate-like shape. One end of the conductor is arranged to be connectable to an outside. One surface side of another end of the conductor is fixed to a surface of the wiring hoard. The conductor includes at least one protruding step on the one surface of the other end. A top portion of the protruding step includes a contact surface parallel to the surface of the wiring board. The other end of the conductor is fixed to the wiring board by the contact surface and the surface of the wiring board coming into close contact with each other.

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