The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Jul. 05, 2018
Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Minato-ku, Tokyo, JP;

Inventor:

Kazuhiro Inoue, Himeji Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/3114 (2013.01);
Abstract

Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.


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