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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10615101 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Dec. 28, 2017

Electronic device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yasunobu Shoji, Kyoto, JP;

Tomoichiro Toyama, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Douglas M Menz

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4825 (2013.01); H01L 23/13 (2013.01); H01L 23/4952 (2013.01); H01L 23/49805 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 33/62 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/35121 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An electronic device includes: a base; a wiring pattern formed on the base; an electronic element disposed on the wiring pattern; and a bonding layer interposed between the electronic element and the wiring pattern, wherein an opening is formed in the wiring pattern and the bonding layer is in contact with a portion of the base exposed by the opening in the wiring pattern.

Find Patent Forward Citations

Shoji, Yasunobu. (2020). Electronic device (U.S. Patent No. 10615101). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10615101

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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