The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Feb. 20, 2017
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Soichiro Umeda, Hanno, JP;
Yuji Morinaga, Hanno, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 23/12 (2013.01); H01L 23/562 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/02 (2013.01); H01L 23/3107 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49431 (2013.01);
Abstract
An electronic device has a substrate, a first conductor layerprovided on the substrate, a second conductor layerprovided on the substrate; an electronic element provided on the first conductor layer, and a sealing partcovering the substrate, the first conductor layer, the second conductor layer, and the electronic element. The first conductor layeris not provided on a virtual straight line VL including the second conductor layerin an in-plane direction of the substrate. The second conductor layeris sealed inside the sealing partand covered only with the sealing part