The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Jul. 30, 2018
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventor:
Tadahiko Sato, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/04 (2006.01); H01L 23/29 (2006.01); H01L 23/367 (2006.01); H01L 23/544 (2006.01); H01L 23/495 (2006.01); H01L 23/24 (2006.01); H01L 23/057 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/057 (2013.01); H01L 23/24 (2013.01); H01L 23/293 (2013.01); H01L 23/367 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/544 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A semiconductor device having a housing is provided, where the housing includes the first surface, concave portions provided to the first surface, the second surface to face toward the first surface, and convex portions provided in contact with the second surface. In a thickness direction of the housing directed from the first surface to the second surface, the concave portions and the convex portions are provided at positions corresponding to each other.