The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Oct. 22, 2012
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Hirohisa Akita, Fukuoka, JP;
Makoto Amano, Fukuoka, JP;
Kazuhiko Yokota, Fukuoka, JP;
Rikiya Yamashita, Fukuoka, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
Provided is a packaging material for an electrochemical cell which prevents the occurrence of short circuits. A packaging material for an electrochemical cell configured by laminating a base material layer including: at least a resin film; a heat-adhesive layer including a heat-adhesive resin, the heat-adhesive layer being disposed on the innermost layer; and a barrier layer including a metal foil, the barrier layer being disposed between the base material layer and the heat-adhesive layer, wherein a chemical-conversion-treated layer including alumina particles and modified epoxy resin is formed on the surface of at least the heat adhesive layer side of the barrier layer.