The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Mar. 06, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Pradip Bose, Yorktown Heights, NY (US);

Alper Buyuktosunoglu, White Plains, NY (US);

Timothy Joseph Chainer, Putnam Valley, NY (US);

Pritish Ranjan Parida, Fishkill, NY (US);

Augusto Javier Vega, Astoria, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 16/00 (2006.01); G06F 1/20 (2006.01); G06F 1/3206 (2019.01); G06F 1/324 (2019.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); G06F 1/324 (2013.01); G06F 1/3206 (2013.01); G06F 2200/201 (2013.01); Y02D 10/126 (2018.01); Y02D 10/16 (2018.01);
Abstract

Techniques for inducing heterogeneous microprocessor behavior using non-uniform cooling are described. According to an embodiment, a device is provided that comprises an IC chip comprising a plurality of cores and a cooling apparatus coupled to the integrated chip that cools the integrated chip in association with electrical operation of the plurality of cores. The cooling apparatus cools a first core of the plurality of cores to a lower temperature than a second core of the plurality of cores. In various embodiments, the cooling apparatus comprises a plurality of channels embedded within the integrated chip and the cooling apparatus cools the integrated chip via flow of liquid coolant through the plurality of channels.


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