The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Feb. 27, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Tomoyuki Sasaki, Tokyo, JP;

Yoshitomo Tanaka, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/10 (2006.01); G01R 33/09 (2006.01); H01L 43/02 (2006.01); H01L 27/22 (2006.01); H01L 43/08 (2006.01); G11C 11/16 (2006.01); H01L 21/8239 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
G01R 33/093 (2013.01); G01R 33/098 (2013.01); G11C 11/161 (2013.01); H01L 21/8239 (2013.01); H01L 27/226 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01); H01L 27/228 (2013.01);
Abstract

A ferromagnetic multilayer film includes first and second magnetization fixed layers, first and second interposed layers, and a magnetic coupling layer. The magnetization fixed layers are antiferromagnetically coupled by exchange coupling via the interposed layers and the magnetic coupling layer. A main element of the magnetic coupling layer is Ru, Rh, or Ir. A main element of the first interposed layer is the same as that of the magnetic coupling layer. A main element of the second interposed layer is different from that of the magnetic coupling layer. A thickness of the first interposed layer is greater than or equal to 1.5 times and less than or equal to 3.2 times an atomic radius of the main element of the first interposed layer. A thickness of the second interposed layer is less than or equal to 1.5 times an atomic radius of the main element of the second interposed layer.


Find Patent Forward Citations

Loading…