The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Jul. 09, 2018
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Leo Van Gemert, Nijmegen, NL;

Peter Drummen, Someren, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); G01R 31/2856 (2013.01); H01L 21/78 (2013.01); H01L 22/34 (2013.01); H01L 23/3114 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/05 (2013.01); H01L 2224/0401 (2013.01);
Abstract

An apparatus comprising: a substrate; an integrated circuit region formed in the substrate; a seal ring disposed in the substrate to form a ring around the integrated circuit region, the seal ring configured to provide for protection against one or more of moisture ingress and ion ingress to the integrated circuit region and crack propagation through the substrate; and a defect sensor comprising a conductive track formed of at least one conductive layer in the substrate, the conductive track disposed outwardly of the seal ring and arranged to at least partially surround the integrated circuit region and seal ring, the conductive track having a first end terminal and a second end terminal to receive a detection signal therebetween to pass through the conductive track to detect a break in the conductive track and thereby a defect in the substrate.


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