The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Mar. 28, 2019
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Yuji Takematsu, Tokyo, JP;

Kenji Okamoto, Tokyo, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2875 (2013.01); G01R 31/2851 (2013.01); G01R 31/2896 (2013.01); H01L 23/29 (2013.01); H01L 23/3121 (2013.01); H01L 24/01 (2013.01); G01R 31/2856 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration.


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