The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Nov. 25, 2016
Applicant:

Cemecon Ag, Würselen, DE;

Inventors:

Stephan Bolz, Aachen, DE;

Oliver Lemmer, Aachen, DE;

Antonius Leyendecker, Herzogenrath, DE;

Assignee:

CemeCon AG, Würselen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/27 (2006.01); C23C 14/02 (2006.01); C23C 16/02 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/27 (2013.01); C23C 14/022 (2013.01); C23C 16/0281 (2013.01); C23C 28/324 (2013.01); C23C 28/341 (2013.01); C23C 28/343 (2013.01); C23C 28/347 (2013.01); C23C 28/36 (2013.01); C23C 28/44 (2013.01);
Abstract

The invention relates to a coated body and to a method for coating a body. The coated body comprises at least a substrate (), a diamond layer () having a thickness of 1-40 μm, and a hard material layer (), which is arranged farther outside on the body () than the diamond layer (). The hard material layer () comprises at least one metal element and at least one non-metal element. An adhesive layer () having a thickness of 2-80 nm is provided between the diamond layer () and the hard material layer (). The adhesive layer () contains carbon and at least one metal element. The diamond layer () can be applied by means of a CVD method. The hard material layer can be applied by means of a PVD method. The adhesive layer () between the diamond layer () and the hard material layer () can be produced in that, before the hard material layer () is applied, the surface of the diamond layer () is pretreated by means of HIPIMS metal ion etching, wherein ions are implanted into or diffuse into the surface of the diamond layer () by means of metal ion etching.


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