The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Oct. 08, 2015
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Yoshimasa Koido, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); B22F 3/10 (2006.01); C22C 28/00 (2006.01); B22F 5/00 (2006.01); C23C 14/06 (2006.01); C22C 1/04 (2006.01); B22F 3/14 (2006.01); C22C 30/00 (2006.01); H01J 37/34 (2006.01); C22C 21/00 (2006.01); C22C 30/02 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 3/10 (2013.01); B22F 3/14 (2013.01); B22F 5/00 (2013.01); C22C 1/04 (2013.01); C22C 1/0416 (2013.01); C22C 21/00 (2013.01); C22C 28/00 (2013.01); C22C 30/00 (2013.01); C22C 30/02 (2013.01); C23C 14/0623 (2013.01); H01J 37/3426 (2013.01); B22F 2201/013 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22F 1/00 (2013.01);
Abstract

A sputtering target containing 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr, and remainder being Al, wherein a structure of the sputtering target is comprise of an Al phase, a Cu phase, a CuTeZr phase, a CuTe phase and a Zr phase. The present invention aims to provide an Al—Te—Cu—Zr-based alloy sputtering target capable of effectively suppressing the degradation of properties caused by compositional deviation, as well as a method of manufacturing the same.


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