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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10612112 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Apr. 08, 2016

Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same

Applicants:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Daelim Chemical Co., Ltd., Gyeongsangnam-do, KR;

Inventors:

Yong Suk Yang, Daejeon, KR;

Hong Hyun Shin, Seoul, KR;

In-Kyu You, Gongju-Si, KR;

Sunghoon Hong, Daejeon, KR;

Assignees:

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;

DAELIM CHEMICAL CO., LTD., Gyeongsangnam-Do, KR;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Scott R Kastler

Assistant Examiner:

Vanessa T Luk

Int. Cl.
CPC ...
C22C 5/02 (2006.01); C22C 1/02 (2006.01); B22F 3/00 (2006.01); B23K 35/30 (2006.01); B23K 103/08 (2006.01); C22C 1/04 (2006.01); B22D 21/00 (2006.01); B22D 23/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B22F 3/115 (2006.01); C04B 35/653 (2006.01); C04B 35/26 (2006.01); C04B 35/45 (2006.01); B22F 3/20 (2006.01); B22F 3/105 (2006.01);
U.S. Cl.
CPC ...
C22C 5/02 (2013.01); B22D 21/005 (2013.01); B22D 23/00 (2013.01); B22D 23/003 (2013.01); B22F 3/008 (2013.01); B22F 3/115 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C04B 35/26 (2013.01); C04B 35/45 (2013.01); C04B 35/653 (2013.01); C22C 1/02 (2013.01); C22C 1/0466 (2013.01); B22F 3/1055 (2013.01); B22F 3/20 (2013.01); B23K 35/3013 (2013.01); B23K 2103/08 (2018.08); C04B 2235/6021 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/6565 (2013.01); Y02P 10/295 (2015.11);
Abstract

Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.

Find Patent Forward Citations

Yang, Yong. (2020). Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same (U.S. Patent No. 10612112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10612112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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