The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Mar. 23, 2018
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Minchul Lee, Seongnam-si, KR;
Namil Koo, Hwaseong-si, KR;
Kyungrim Kim, Anyang-si, KR;
Sun-Woo Park, Anyang-si, KR;
Yongin Park, Seoul, KR;
Min-Woo Lee, Hwaseong-si, KR;
Wonhee Choe, Seoul, KR;
Hun Rae Kim, Daejeon, KR;
Dong-Sel Kim, Incheon, KR;
Zeeyoung Lee, Daejeon, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
GAEMA TECH, Daejeon, KR;
Abstract
Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.