The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Dec. 17, 2016
Applicant:

Hosokawa Yoko Co., Ltd., Tokyo, JP;

Inventors:

Yukio Kobayashi, Tokyo, JP;

Yohei Kageyama, Tokyo, JP;

Munenori Miyazaki, Tokyo, JP;

Yoshihiro Kojima, Kagawa, JP;

Yoshikazu Tanaka, Kagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01); B29C 55/28 (2006.01); B29C 48/08 (2019.01); B29C 48/00 (2019.01); B29C 48/21 (2019.01); B32B 27/26 (2006.01); B29K 23/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B29C 48/0018 (2019.02); B29C 48/08 (2019.02); B29C 48/21 (2019.02); B29C 55/28 (2013.01); B32B 27/08 (2013.01); B32B 27/26 (2013.01); B32B 27/327 (2013.01); B65D 65/40 (2013.01); B29K 2023/0633 (2013.01); B29K 2995/0081 (2013.01); B29L 2031/712 (2013.01); B29L 2031/7128 (2013.01); B32B 2307/30 (2013.01); B32B 2307/31 (2013.01); B32B 2307/516 (2013.01); B32B 2307/54 (2013.01); B32B 2307/558 (2013.01); B32B 2439/40 (2013.01); B32B 2439/46 (2013.01); B32B 2553/00 (2013.01); B32B 2581/00 (2013.01);
Abstract

In order to provide a polyethylene sealant film having great strength and good heat sealability, despite being thin, a multilayer polyethylene sealant film is produced by a method including coextruding and stretching a sealant layer formed of a low density polyethylene resin or linear low density polyethylene resin and an orientation layer including a polyethylene resin having a melting point higher than the sealant layer, by an inflation method at a temperature higher than the melting point of the sealant layer and higher than the Vicat softening temperature, but lower than the melting point of the orientation layer.


Find Patent Forward Citations

Loading…