The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10611067 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 07, 2020

Filed:

Aug. 31, 2018
Applicant:

Securitag Assembly Group Co., Ltd, Taichung, TW;

Inventor:

Way Yu Chen, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/00 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/72 (2006.01); G06K 19/077 (2006.01); B29C 39/10 (2006.01); B29C 33/38 (2006.01); B29L 31/34 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0001 (2013.01); B29C 33/38 (2013.01); B29C 39/10 (2013.01); B29C 45/14819 (2013.01); B29C 45/7207 (2013.01); G06K 19/07724 (2013.01); B29K 2101/10 (2013.01); B29K 2883/00 (2013.01); B29L 2031/3456 (2013.01);
Abstract

The present invention provides a system and method for packaging RFID device, in which a flexible mold with low surface energy having a mold cavity formed on a surface thereof is provided, an RFID device having RFID chip and antenna coupled thereto is then arranged in the mold cavity, a thermosetting material is filled in the mold cavity under a first atmospheric pressure produced by a pressure controlling device whereby the RFID device is completely covered by the thermosetting material, after that, the pressure controlling device provides a second atmospheric pressure higher than the first atmospheric pressure under a temperature lower than the curing temperature of the thermosetting material, and finally, the temperature is increased to the curing temperature under the second atmospheric pressure for curing the thermosetting material thereby forming an RFID package having the RFID device and the thermosetting material covered the RFID device.


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Chen, Way. (2020). System and method for packaging frequency identification device and rfid device formed thereof (U.S. Patent No. 10611067). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10611067

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