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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10611049 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Sep. 13, 2018

Aqueous bonding composition

Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Tsuyoshi Tamogami, Osaka, JP;

Yoshio Yoshida, Osaka, JP;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Robert D Harlan

Int. Cl.
CPC ...
B27N 3/00 (2006.01); C13B 50/00 (2011.01); C08L 29/04 (2006.01); C08K 3/16 (2006.01); C09J 105/00 (2006.01); B27N 1/02 (2006.01); C08K 3/28 (2006.01); C08K 3/32 (2006.01); C08K 5/1535 (2006.01);
U.S. Cl.
CPC ...
B27N 3/002 (2013.01); B27N 1/0209 (2013.01); C08K 3/16 (2013.01); C08K 3/28 (2013.01); C08K 3/32 (2013.01); C08K 5/1535 (2013.01); C08L 29/04 (2013.01); C09J 105/00 (2013.01); C13B 50/006 (2013.01); C08K 2003/166 (2013.01); C08K 2003/322 (2013.01); C08L 2201/54 (2013.01);
Abstract

Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.

Find Patent Forward Citations

Tamogami, Tsuyoshi. (2020). Aqueous bonding composition (U.S. Patent No. 10611049). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10611049

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