The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Sep. 29, 2016
Origin Electric Company, Limited, Saitama, JP;
Koki Company Limited, Tokyo, JP;
Yukiko Hayashi, Saitama, JP;
Arisa Shiraishi, Saitama, JP;
Naoto Ozawa, Saitama, JP;
Takayuki Suzuki, Saitama, JP;
Takeshi Shirai, Tokyo, JP;
Noriyoshi Uchida, Tokyo, JP;
Mitsuyasu Furusawa, Tokyo, JP;
ORIGIN COMPANY, LIMITED, Saitama, JP;
KOKI COMPANY LIMITED, Tokyo, JP;
Abstract
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.