The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Apr. 03, 2014
Applicant:

Lpkf Laser & Electronics Ag, Garbsen, DE;

Inventors:

Robin Alexander Krueger, Hannover, DE;

Norbert Ambrosius, Kevelaer, DE;

Roman Ostholt, Langenhagen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/382 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); B23K 26/402 (2014.01); H01L 21/48 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23K 26/0006 (2013.01); B23K 26/064 (2015.10); B23K 26/0624 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); H01L 21/486 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01);
Abstract

A method for producing a recess or through-opening in a substrate includes applying pulsed laser radiation to the substrate. The laser radiation is focused using an optical system at an original focal depth and, by non-linear self-focusing within the pulse duration of an individual pulse, is also focused by the optical system at a focal depth different from the original focal depth. A difference between the focal depths corresponds to or is greater than the longitudinal extent of the recess or though-opening to be produced. The laser radiation modifies the substrate along a beam axis of the laser radiation in the region of the recess or through-opening, but does not result in removal of the substrate material necessary to form the recess or the through-opening. The substrate material in the modified region is anisotropically removed to produce the recess or through-opening in the substrate.


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