The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Nov. 27, 2017
Applicant:

Newpace Ltd., Caesarea, IL;

Inventors:

Gera Strommer, Haifa, IL;

Avi Broder, Petach Tikva, IL;

Moti Mocha, Beit Dagan, IL;

Robert S. Fishel, Delray Beach, FL (US);

Nahum Natan, Tel Aviv, IL;

Assignee:

NewPace Ltd., Caesarea, unknown;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61B 5/07 (2006.01); A61B 5/00 (2006.01); A61N 1/378 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3752 (2013.01); A61B 5/0031 (2013.01); A61B 5/076 (2013.01); A61N 1/36125 (2013.01); A61N 1/3758 (2013.01); A61N 1/37512 (2017.08); A61B 2560/0418 (2013.01); A61N 1/3756 (2013.01); A61N 1/3787 (2013.01);
Abstract

An encapsulation configuration for electronic components in a flexible implantable medical device, including at least one set of folded circuit boards and a filler material, the set of folded circuit boards including a plurality of circuit boards and a plurality of connection cables, each one of the circuit boards including at least one electronics component, each one of the circuit boards having a generally rectangular shape, the connection cables electrically coupling adjacent ones of the circuit boards and the circuit boards being folded over one another in a pleated manner, the filler material surrounding the set of folded circuit boards, the filler material and the set of folded circuit boards together having a cylindrical shape, the set of folded circuit boards being positioned lengthwise in the cylindrical shape and the electronics component being positioned on the set of folded circuit boards to achieve optimal volume consumption in the electronics encapsulation.


Find Patent Forward Citations

Loading…