The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Oct. 12, 2018
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Hiroyuki Motohara, Hachioji, JP;

Kazuki Kawachi, Yokohama, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/00 (2006.01); H05K 1/18 (2006.01); H04N 5/225 (2006.01); H01L 23/12 (2006.01); G02B 23/24 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
A61B 1/05 (2013.01); A61B 1/00124 (2013.01); G02B 23/24 (2013.01); H01L 23/12 (2013.01); H04N 5/225 (2013.01); H04N 5/2253 (2013.01); H05K 1/14 (2013.01); H05K 1/18 (2013.01);
Abstract

A disclosed electronic circuit unit includes a first circuit board in which first electrode pads, mounting lands and second electrode pads are formed and that has vias and wirings; a second circuit board in which third electrode pads and dummy pads are formed and that has vias and wirings; and electronic components that are connected to the mounting lands. When the dummy pads are projected in the direction orthogonal to a surface, one of the dummy pads is overlapped one of electrodes of one of the electronic components. The mounting lands for the electronic components overlapping the dummy pads at the time of the projection are connected to, by connecting members, the second electrode pads, the wirings, and the like, the dummy pads connected to the third electrode pads by the wirings or the like.


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